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  • 专利标题:   Assembly for use in die of integrated circuit has second layer that contains fluorinated graphene and disposed directly on first layer that contains graphene.
  • 专利号:   WO2015191089-A1, TW201611206-A, KR2017019338-A, CN106463478-A, US2017077235-A1, EP3155659-A1, JP2017527975-W, EP3155659-A4, TW616989-B1, US10186582-B2
  • 发明人:   CAUDILLO R, AVCI U, AVCI U E
  • 专利权人:   INTEL CORP, CAUDILLO R, AVCI U, INTEL CORP
  • 国际专利分类:   H01L023/14, H01L023/18, H01L021/02, H01L023/532, H01L029/51, H01L029/66, H01L021/04, H01L027/088, H01L029/16, H01L029/49, H01L029/786, H01L021/205, H01L021/28, H01L021/283, H01L021/3205, H01L021/471, H01L021/768, H01L051/30, H01L029/423, H01L029/778, B82Y025/00, B82Y030/00, H01L023/29
  • 专利详细信息:   WO2015191089-A1 17 Dec 2015 H01L-023/14 201602 Pages: 38 English
  • 申请详细信息:   WO2015191089-A1 WOUS042395 13 Jun 2014
  • 优先权号:   CN80078805, EP894479, JP566738, KR730578, WOUS042395, US15123242

▎ 摘　　要

NOVELTY - The assembly has a first layer that contains graphene, and a second layer that contains fluorinated graphene disposed directly on first layer. The first layer is disposed directly on third layer containing graphene. A third layer containing fluorinated graphene is disposed directly on second layer of fluorinated graphene. A layer of electrically insulative material is disposed on second layer of fluorinated graphene. An electrically conductive material is disposed on layer of electrically insulative material. USE - Assembly for use in die (claimed) of integrated circuit used in computing device (claimed). Uses include but are not limited to mobile computing device, laptop, netbook, notebook, ultrabook, smartphone, tablet, personal digital assistant (PDA), ultra mobile personal computer (PC), mobile phone, desktop computer, server, printer, scanner, monitor, set-top box, entertainment control unit, digital camera, portable music player, or digital video recorder. ADVANTAGE - The use of multi-layer assemblies with at least one fluorinated graphene layer allows the graphene to be interfaced with other materials and used in integrated circuit (IC) devices without degradation of its conductance or high mobility. The fluorinated graphene layer/s provide insulative interface to the other graphene layers, which maintain their desirable conductance and mobility performance. The fluorinated graphene layer provides pin-hole free dielectric material and/or interface that is atomically thin and that circumvents typical issues encountered in depositing a pin-hole free high-quality dielectric on graphene. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of fabricating an assembly. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram of a method of fabricating a graphene assembly. Graphene assembly fabrication method (600) Multilayer stack providing step (602) Graphene of first layer fluorinating step (604) Additional layer coupling step (606) Graphene of additional layer fluorinating step (608)