• 专利标题:   Electromagnetic interference shielding film for flexible printed circuit board, consists of conductive adhesive layer formed using composition comprising acrylate solution, divalent acid ester solution, conductive particles and solvent.
  • 专利号:   US11013156-B1, CN113973488-A, TW202204552-A
  • 发明人:   YU P, LIU H, CHANG Y, HUANG S, YOU B, LIU X, ZHANG Y
  • 专利权人:   NANOBIT TECH CO LTD, NANOBIT TECH CO LTD, NANOBIT TECH CO LTD
  • 国际专利分类:   C09J007/29, C09J009/02, H05K009/00, B32B015/08, C09J011/04, C09J011/06, C09J133/08
  • 专利详细信息:   US11013156-B1 18 May 2021 H05K-009/00 202153 English
  • 申请详细信息:   US11013156-B1 US994590 15 Aug 2020
  • 优先权号:   TW124908

▎ 摘  要

NOVELTY - An electromagnetic interference (EMI) shielding film comprises a flexible composite metal layer (10) comprising at least two metal layers stacked, a transparent insulating layer (20) provided on one surface of the flexible composite metal layer, and a conductive adhesive layer (30) provided on the other surface of the flexible composite metal layer. The conductive adhesive layer is formed by removing a solvent from a conductive adhesive composition comprising 30-40 pts. wt. acrylate solution, 30-40 pts. wt. divalent acid ester solution, 2-5 pts. wt. conductive particles and a solvent. The acrylate solution comprises 30-40 pts. wt. acrylate. 50% Conductive particles have particle size of 5-10 microns. USE - Electromagnetic interference shielding film for flexible printed circuit board. ADVANTAGE - The electromagnetic interference shielding film has excellent adhesive strength and electrical reliability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of EMI shielding film, which involves stacking at least two metal layers into flexible composite metal layer, providing transparent insulating layer on one surface of the flexible composite metal layer, and providing conductive adhesive layer on the other surface of the flexible composite metal layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of electromagnetic interference shielding film. Flexible composite metal layer (10) Soft silver metal layer (11) Transparent insulating layer (20) Conductive adhesive layer (30) Release films (40,50)