▎ 摘　　要

NOVELTY - An electronic adhesive comprises 10-25 pts. wt. epoxy resin, 2-8 pts. wt. reactive diluent, 3-8 pts. wt. two-component curing agent, 1-2 pts. wt. accelerator, 0.5-1 pt. wt. coupling agent, 1-3 pts. wt. aminated graphene oxide, 0.5-1.5 pts. wt. one-dimensional carbon nanotubes, and 50-80 pts. wt. composite silver powder. The two-component curing agent is a mixture of dicyandiamide curing agent and imidazole curing agent. The composite silver powder is a mixture of sheet silver powder and spherical silver powder. USE - Electronic adhesive is used for packaging graphene-based semiconductor chips. ADVANTAGE - The electronic adhesive comprises graphene oxide, carbon nanotubes, and conductive metal particles, which form uniform space structure of surface/line/point, with excellent volume resistivity and conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the electronic adhesive, which involves adding the epoxy resin and reactive diluent to a double planetary power mixing stirrer, stirring, adding the curing agent, accelerator, coupling agent, aminated graphene oxide, and one-dimensional carbon nanotubes, stirring, adding the composite silver powder, stirring, adding the stirred material to a ceramic three-roller machine, rolling, defoaming, discharging, and refrigerating.