• 专利标题:   Vertical orientation structure thermal interface material useful in high-efficiency heat management of large-power electronic devices, comprises organic polymer matrix and thin film with vertical sheet orientation structure.
  • 专利号:   CN115895262-A
  • 发明人:   LI K, YANG X, YANG K, XIN G
  • 专利权人:   UNIV HUAZHONG SCI TECHNOLOGY
  • 国际专利分类:   C08K003/04, C08K003/38, C08K009/02, C08K009/04, C08L083/04
  • 专利详细信息:   CN115895262-A 04 Apr 2023 C08L-083/04 202336 Chinese
  • 申请详细信息:   CN115895262-A CN10546814 19 May 2022
  • 优先权号:   CN10546814

▎ 摘  要

NOVELTY - Vertical orientation structure thermal interface material comprises composite thermal interface material of an organic polymer matrix and a thin film with a vertical sheet alignment structure. USE - Vertical orientation structure thermal interface material useful in high-efficiency heat management of large-power electronic devices. ADVANTAGE - The thermal interface material has realizes the production and preparation of large area customized, low cost and uses the size limit influence of the high depth-width ratio micro-pipeline mold and the extrusion expansion effect of the non-Newtonian fluid at the mold outlet. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of the vertical orientation structure thermal interface material. DESCRIPTION OF DRAWING(S) - The drawing shows a preparation method flow chart of the vertical orientation structure heat interface material (Drawing includes non-English language text).