▎ 摘　　要

NOVELTY - Silicone pad (10) for hot press comprises a pad made of silicon material set on the upper and lower parts of the circuit board in the hot press process of forming an insulating resin layer through hot press during the circuit board manufacturing process. The pad includes a first layer (1) made of a silicon material that is hardened into a plate shape by mixing a thermal diffusion material (3) for adjusting the vertical thermal conductivity to a preset range. USE - The silicone pad for hot press is useful for preventing damage due to bending. ADVANTAGE - The silicone pad for hot press can be reused to reduce which reduces cost and generation of industrial waste. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the silicone pad. First layer (1) Thermal diffusion material (3) Silicone pad (10)