• 专利标题:   Preparation of heat-conducting material used for electronic device, by dripping mixed solution prepared using sheet-shaped heat-conducting filler and polymer material solution on saturated sodium sulfate aqueous solution for salting out, obtaining film-shaped composite material, clamping and drying.
  • 专利号:   CN115678066-A
  • 发明人:   ZHAO Z, CHEN W, YAN C
  • 专利权人:   UNIV JIANGSU SCI TECHNOLOGY
  • 国际专利分类:   C08J005/18, C08K003/04, C08K003/22, C08K003/34, C08K003/38, C08K007/00, C08L029/04
  • 专利详细信息:   CN115678066-A 03 Feb 2023 C08J-005/18 202319 Chinese
  • 申请详细信息:   CN115678066-A CN11398770 09 Nov 2022
  • 优先权号:   CN11398770

▎ 摘  要

NOVELTY - Preparation of anisotropic high heat-conducting flexible material involves: (1) adding a sheet-shaped heat-conducting filler to a polymer material solution to obtain a mixed solution; (2) dripping the mixed solution on a saturated sodium sulfate aqueous solution for salting out, and obtaining a film-shaped composite material after salting out; and (3) clamping the film-shaped composite material using a flat plate, pressurizing, and drying in an oven. USE - Preparation of anisotropic high heat-conducting flexible material (claimed) used for electronic device. ADVANTAGE - The method is simple, feasible, and suitable for mass production, and provides anisotropic high heat-conducting flexible material, which can promote the rapid development of flexible electronic packaging heat dissipation material. The mechanical properties of the polymer material are preserved to the greatest extent because the filling amount of the filler is low.