▎ 摘　　要

NOVELTY - The heat conducting composite material layer has two-dimensional layered material layer that is composed of single or double layer or boron nitride, and two-dimensional layered material layer formed of graphene. The boron nitride layer is used as insulation protection layer of integrated circuit device. The graphene layer is transferred on the surface of boron nitride layer. USE - Heat conducting composite material layer of integrated circuit device used for microelectronics device heat-conducting structure (claimed). ADVANTAGE - The thermal conductivity of graphene is improved. The cooling requirements are met. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method for packaging electron device heat-conducting structure. DESCRIPTION OF DRAWING(S) - The drawing shows a graph illustrating the data contrast image of chip sample prepared using chemical gas phase depositing method. (Drawing includes non-English language text)