• 专利标题:   Liquid metal thermal interface material with self-encapsulation function comprises high thermal conductivity filler and liquid metal.
  • 专利号:   CN112981207-A, CN112981207-B
  • 发明人:   GUO H, XIE Z, ZHANG X
  • 专利权人:   GRINM ENG TECHNOLOGY RES INST CO LTD
  • 国际专利分类:   C09K005/06, C22C001/04, C22C012/00, C22C028/00, C22C030/00
  • 专利详细信息:   CN112981207-A 18 Jun 2021 C22C-030/00 202161 Pages: 7 Chinese
  • 申请详细信息:   CN112981207-A CN11292500 12 Dec 2019
  • 优先权号:   CN11292500

▎ 摘  要

NOVELTY - A liquid metal thermal interface material with self-encapsulation function comprises 70-99 vol.% liquid metal, and 1-30 vol.% high thermal conductivity filler. USE - Liquid metal thermal interface material with self-encapsulation function. ADVANTAGE - The thermal interface material has high melting point portion as solid and low melting point portion as liquid in which the solid portion restricts the flow of liquid portion and acts as a self-encapsulation, high flexibility and no fluidity at the same time, high thermal conductivity of more than 60 W/mK, and good workability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the liquid metal thermal interface material comprising mixing high melting point liquid metal powder, low melting point liquid metal powder and high thermal conductivity filler, ultrasonically cleaning in ethanol, ultrasonically cleaning in deionized water, filtering, drying, and weighing according to required ratio; adding to ultrasonic shaker, adding deionized water, ultrasonically vibrating, filtering, drying, adding to hot pressing mold, and molding to 3-5 mm thick flake; and low speed multi-roll milling to thickness of 50-800 mu m plate.