• 专利标题:   Force calculating plate assembly for use in data processing device of data processing device system, has graphene heating film that is arranged on circuit board or heat dissipation device for heating chip.
  • 专利号:   CN113900987-A, CN216211009-U
  • 发明人:   HU H, LI Y, HAO M, GE Y
  • 专利权人:   BEIJING BITMAIN TECHNOLOGY CO LTD
  • 国际专利分类:   G06F015/78, H05B003/14, H05B003/20, H05K007/20
  • 专利详细信息:   CN113900987-A 07 Jan 2022 G06F-015/78 202215 Chinese
  • 申请详细信息:   CN113900987-A CN11289683 02 Nov 2021
  • 优先权号:   CN11289683, CN22667754

▎ 摘  要

NOVELTY - The assembly has a computing power board that includes a circuit board and a chip (12) is mounted on the circuit board. A heat dissipation device is connected to the circuit board for heat dissipation of the computing power board. A graphene heating film (30) is arranged on the circuit board or the heat dissipation device for heating the chip. The chip is mounted on the first board surface, and the heat dissipation device includes a first heat sink (211). The first heat sink is connected to the first board surface, and the graphene heating film is arranged on the circuit board or the first heat sink. USE - Force calculating plate assembly for use in data processing device of data processing device system (all claimed). ADVANTAGE - The force calculating plate assembly solves the technical problem that the computer cannot be normally started in the low temperature environment. The working of the force plate under extremely cold condition is ensured to be used in the normal environment. DESCRIPTION OF DRAWING(S) - The drawing shows a partial enlarged view of the force calculating plate assembly. Chip (12) Graphene heating film (30) First heat sink (211) First heat dissipation substrate (212) First radiating contact portion (213) First groove (214)