▎ 摘　　要

NOVELTY - The method involves placing a graphene sheet (115) on a substrate. First metal layer is mounted on top of the graphene sheet. A passivation layer is mounted on a top of the first metal layer. A photoresist layer is mounted on top of the passivation layer. Second metal layer is mounted between the first metal layer and the passivation layer, where the passivation layer comprises a dielectric layer. The photoresist layer is etched to expose a surface of the passivation layer. The passivation layer is removed by a dry etching mechanism. USE - Method for producing a graphene well on a graphene sheet. ADVANTAGE - The method enables applying gold coating to protect graphene from being potentially contaminated during wire bonding, encapsulation, wafer dicing and cleaning as the graphene sheet is prepared for installation within a sensor or device. The method enables allowing the passivation layer to effectively reduce reverse-current leakage, increase breakdown voltage and raise power dissipation rating, so that the passivation layer is mounted over metal connections on a graphene wafer to prevent electrical currents from leaking and damaging the graphene based devices. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a graphene sheet applied with a metal coating. Wafer (105) Platinum (110) Graphene sheet (115) Metal coating (120)