• 专利标题:   Heat dissipation adhesive tape with high heat dissipation performance used for electronic product e.g. mobile phone and heat source with low power and small radiator, has surface heat dissipation layer, heat conduction base material and heat conduction adhesive layer arranged from top to bottom.
  • 专利号:   CN115477902-A
  • 发明人:   HAN K
  • 专利权人:   GUANGDONG DONGLI NEW MATERIALS SCI TEC
  • 国际专利分类:   C09D111/00, C09D007/61, C09J011/04, C09J133/08, C09J007/28, C09J007/30
  • 专利详细信息:   CN115477902-A 16 Dec 2022 C09J-007/28 202311 Chinese
  • 申请详细信息:   CN115477902-A CN10154817 21 Feb 2022
  • 优先权号:   CN10154817

▎ 摘  要

NOVELTY - Heat dissipation adhesive tape with high heat dissipation performance comprises a surface heat dissipation layer (1), a heat conduction base material and a heat conduction adhesive layer (3) arranged from top to bottom. USE - The adhesive tape is useful for electronic products e.g. TV and mobile phone. Can also be used for fixing LED radiator and heat source with low power and small radiator. ADVANTAGE - The adhesive tape has synergistic effect of the heat conduction base material and the heat conduction adhesive layer, which increases the surface of heat dissipation layer, and maximizes the effect of heat dissipation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing heat dissipation adhesive tape with high heat dissipation performance comprising (1) adding heat-dissipating filler A and solvent into the rubber-based adhesive, and stirring uniformly to obtain a surface heat-dissipating layer, (2) heating heat-dissipating filler B and solvent mixture, heating to 60-70℃ and maintaining temperature, adding adhesive, stirring uniformly, adding hardener, surfactant, tin catalyst, stirring, maintaining temperature at 50-60℃ for 7-10 hours to obtain a heat conduction adhesive layer, and (3) coating a heat conduction adhesive layer on the lower surface of the heat conduction base, coating a surface heat dissipation layer on the upper surface of the heat conduction base, and calcining in a high-temperature oven at 160-180℃ to obtain a heat-dissipating adhesive tape. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the heat dissipation adhesive tape 1Surface heat dissipation layer 3Heat conduction adhesive layer