▎ 摘　　要

NOVELTY - Graphene heat dissipation potting composition comprises 60-85 wt.% resin, 10-18 wt.% thermally conductive powder, 1-4 wt.% functionalized graphene oxide, 2-4 wt.% dispersant, 1-4 wt.% coupling agent, 2-10 wt.% curing agent and 1-4 wt.% defoamer. USE - The graphene heat dissipation potting composition is useful for forming graphene heat dissipation potting glue used for forming heat dissipation module (claimed), and used in electronic facilities/equipment for efficient heat dissipation. ADVANTAGE - The prepared potting glue has excellent heat dissipation performance and excellent mechanical properties. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a method for preparing a graphene heat dissipation potting glue, involving using the above-mentioned composition, (a) contacting the thermally conductive powder with coupling agent in a portion of the resin to perform a coupling reaction to obtain a mixture (A), in the presence of the dispersant (i), (b) dispersing the functionalized graphene oxide in the remaining portion of the resin to obtain mixture (B), in the presence of dispersant (ii), and (c) mixing the mixture (A) and mixture (B) with the curing agent and defoamer to obtain the glue; and (2) a method for preparing a graphene heat dissipation module, involving curing the above-mentioned potting glue, and molding to obtain the heat dissipation module.