• 专利标题:   Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer, first adhesive layer, first ceramic film layer, second adhesive layer, first insulating layer, third adhesive layer, and second insulating layer.
  • 专利号:   KR2023093729-A, CN116278209-A
  • 发明人:   YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T
  • 专利权人:   INNOX ADVANCED MATERIALS CO LTD
  • 国际专利分类:   B32B007/12, C08K003/10, H05K007/20, B32B027/18, B32B027/20, B32B027/26, B32B027/28, B32B027/30, B32B033/00, B32B009/00, B32B009/04
  • 专利详细信息:   KR2023093729-A 27 Jun 2023 H05K-007/20 202355 Pages: 17
  • 申请详细信息:   KR2023093729-A KR182594 20 Dec 2021
  • 优先权号:   KR182594

▎ 摘  要

NOVELTY - Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer containing a heat radiation filler, first adhesive layer laminated on top of the polymer heat radiation sheet layer, first ceramic film layer laminated on top of the first adhesive layer and including ceramic particles, second adhesive layer laminated on the first ceramic film layer, first insulating layer stacked on top of the second adhesive layer, third adhesive layer laminated under the polymer heat radiation sheet layer, and second insulating layer formed under the third adhesive layer. USE - Used as low dielectric composite heat dissipation sheet. ADVANTAGE - The low dielectric composite heat dissipation sheet implements high thermal conductivity through the polymer heat dissipation sheet layer, exhibits excellent heat dissipation performance, implements low dielectric properties through the ceramic film layer and insulating layer, maximizes heat dissipation performance by applying polymer heat dissipation sheet layer containing graphene particles, laminates ceramic film layer and insulating layer on one or both sides of polymer heat dissipation sheet layer, secures low permittivity, and improves electromagnetic wave shielding performance.