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- 国际专利信息
- 专利标题: Ultra-high power LED chip bonding body with graphene thermal conduction layer.
- 专利号: TW531059-U
- 发明人: HSU C
- 专利权人: UNIV NAT CHIN YI TECHNOLOGY
- 国际专利分类: H01L033/44
- 专利详细信息: TW531059-U 21 Oct 2016 H01L-033/44 201705 Pages: 0 Chinese
- 申请详细信息: TW531059-U TW208511 06 Jun 2016
- 优先权号: TW208511
