▎ 摘　　要

NOVELTY - Preparing organic resin composite material with 3D polyimide as thermally conductive framework comprises mixing the thermally conductive filler, aromatic dianhydride and mixed solvent to perform an esterification reaction to obtain an esterified product, where the mixed solvent includes a small molecule alcohol, mixing the esterified product with aromatic diamine, and performing a polymerization reaction to obtain a polyester ammonium salt precursor, mixing the polyester ammonium salt precursor, water and azobisisobutyronitrile, and sequentially performing thermal foaming and thermal imidization to obtain a thermally conductive filler-polyimide composite foam, mixing the thermally conductive filler-polyimide composite foam with an organic resin, sequentially performing vacuum defoaming and curing. USE - The method is useful for preparing organic resin composite material with 3-dimentional polyimide as thermally conductive framework. ADVANTAGE - The method belongs to the technical field of nanometre composite material and expands the development application of the composite material in the fields of micro-electronics and electronic components. The material has good dendritic network structure for heat conducting filler distributed on the specific space. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for organic resin composite material with 3D polyimide as a thermally conductive framework prepared by the above mentioned method, comprising an organic resin matrix and a 3D polyimide thermally conductive skeleton distributed in the organic resin matrix, where the 3D polyimide thermally conductive skeleton includes 3D polyimide and a thermally conductive filler supported on the 3D polyimide and the thermally conductive filler is uniformly distributed on the 3D polyimide to form a thermally conductive network.