▎ 摘　　要

NOVELTY - The integrated circuit assembly (100) has an electronic substrate (150) and an integrated circuit device (1401,1402,1403) that is electrically attached to the electronic substrate. A potting material layer (180) rests against the electronic substrate and surrounds one integrated circuit device. A structure (190) is provided in the potting material layer. The structure comprises a material having a modulus greater than about 20 gigapascals and a thermal conductivity greater than about 10 watts per meter-Kelvin. The electronic substrate is selected from an active device and a passive device. USE - Integrated circuit assembly of electronic system (claimed), used in integrated circuit industry for continuesly seeking faster, smaller, and thinner integrated circuit packages for use in electronic products such as computer server and portable product such as portable computer, electronic tablet, cell phone, and digital camera. ADVANTAGE - The structures with high modulus and high thermal conductivity in a potting material layer of an integrated circuit package can be achieved. The potting material layer can be any convenient material such as epoxy. The potting material layer can provide structural integrity and prevent contamination. The underfill material can provide structural integrity and prevent contamination. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) an electronic system; and (2) a method of forming integrated circuit assembly. DESCRIPTION OF DRAWING(S) - The drawings show the cross-sectional view of an integrated circuit package and the schematic view of the integrated circuit assembly. Integrated circuit assembly (100) Integrated circuit devices (140-1-140-9) Electronic substrate (150) Potting material layer (180) Structure (190)