• 专利标题:   Polyimide composite film used for electronic component, comprises core layer comprising polyimide resin and graphene, and skin layer comprising another polyimide resin, and has preset electromagnetic wave shielding rate and tensile strength.
  • 专利号:   WO2020096364-A1, KR2020052848-A
  • 发明人:   LEE K N, KIM K H, KIM K
  • 专利权人:   SKCKOLON PI INC
  • 国际专利分类:   B32B027/08, B32B027/18, B32B027/28, C08G073/10, C08K003/04, C08K003/10
  • 专利详细信息:   WO2020096364-A1 14 May 2020 B32B-027/18 202045 Pages: 23
  • 申请详细信息:   WO2020096364-A1 WOKR015045 07 Nov 2019
  • 优先权号:   KR135964, KR141142

▎ 摘  要

NOVELTY - A polyimide composite film comprises a core layer comprising a polyimide resin (A) and graphene, and a skin layer comprising a polyimide resin (B) and formed in a state bonded to both sides of the core layer, and has electromagnetic wave shielding rate of 30-60 dB, modulus of 2-5 GPa, and tensile strength of 180 MPa or more. USE - Polyimide composite film used for electronic component (claimed) used in portable electronic devices, communication devices and optical applications. ADVANTAGE - The polyimide composite film has excellent electromagnetic wave shielding performance, physical properties, sliding properties, thermal conductivity, corona resistance, loop hardness, tensile strength, film forming properties, and insulating properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of polyimide composite film, which involves depositing a composition (C1) comprising a polyamic acid (X) solution and graphene and a composition (C2) comprising a polyamic acid solution (Y) stacked adjacent to each other, and imidizing the film-formed composition (C1) and composition (C2), in which the polyimide composite film comprising a core layer derived from the composition (C1) and a skin layer derived from the composition (C2).