▎ 摘　　要

NOVELTY - The method involves pre-designing a design sketch of a heat shielding component of an electronic element according to geometrical size of the electronic element. A shape memory polymer layer is processed through two environments of high temperature and low temperature. A graphene layer is distributed at intervals on an inner surface of the shape memory polymer layer to form a heat shielding structure. The laser is used to process the graphene connecting portion connected with the lower end of the shape memory polymer layer to form a preformed structure. The pre-forming structure is cut into a heat shielding layer by a laser according to the design sketch of the pre-designing of the component. The electronic element is wrapped by the heat shielding layer. A heat conducting glue is used to adhere the graphene layer and a side of the electronic element. The heat conducting glue is used to adhere the graphene connecting portion with the side of the electronic element. USE - Heat shielding module processing method. ADVANTAGE - The method can simultaneously satisfy the electronic element radiating when the temperature is too high, and the requirement of double function of heat preservation is satisfied when the temperature is too low. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a processing device of heat shielding component, which uses the processing method of the heat shielding component.