• 专利标题:   Graphene-based far infrared radiation heating chip, has hot-melt composite material layer whose top part is connected with bottom of second insulating flame-retardant base material.
  • 专利号:   CN216217609-U
  • 发明人:   SUN J
  • 专利权人:   DONGXU TECHNOLOGY GROUP CO LTD, BEIJING XUTAN NEW MATERIAL TECHNOLOGY CO
  • 国际专利分类:   H05B003/02, H05B003/20
  • 专利详细信息:   CN216217609-U 05 Apr 2022 H05B-003/20 202233 Chinese
  • 申请详细信息:   CN216217609-U CN22457945 12 Oct 2021
  • 优先权号:   CN22457945

▎ 摘  要

NOVELTY - The utility model model relates to a far infrared radiation heating chip based on graphene, the far infrared radiation heating chip has a multi-layer structure, the multi-layer structure comprises: The first insulating flame-retardant base material (1) and the second insulating flame-retardant base material (5), a heating layer (2), a copper-silver composite electrode (3) and a hot-melt composite material layer (4). The electric-heat radiation conversion efficiency of the far infrared radiation heating chip is high, the temperature is uniform, the power is substantially zero attenuation, heat-resistant and flame-resistant, solves the problem of power attenuation in the prior art, short service life, the heating film is not heat-resistant, heat-resistant and flame-resistant, which avoids the occurrence of the safety