• 专利标题:   Preparation of liquid metal in-situ composite graphene thermal interface material used as e.g. effective thermal bonding agent, involves introducing carbon dioxide gas mixed with inert gas in liquid metal heat-conducting paste to react to obtain material.
  • 专利号:   CN114921676-A, CN114921676-B
  • 发明人:   YU Z, SONG T, ZHOU Z, HUANG L
  • 专利权人:   JIANGYIN JIALI MATERIAL TECHNOLOGY CO
  • 国际专利分类:   B22F003/00, C22C001/05, C22C028/00, H05K007/20
  • 专利详细信息:   CN114921676-A 19 Aug 2022 C22C-001/05 202288 Chinese
  • 申请详细信息:   CN114921676-A CN10591059 27 May 2022
  • 优先权号:   CN10591059

▎ 摘  要

NOVELTY - Preparation of liquid metal in-situ composite graphene thermal interface material involves (s1) preparing a gallium-based liquid metal alloy, (s2) adding metal powder to the liquid metal alloy to prepare liquid metal heat conducting paste, and (s3) introducing carbon dioxide or carbon dioxide gas mixed with inert gas in liquid metal heat-conducting paste to react. The liquid metal alloy comprises 50-95 wt.% gallium, 0-50 wt.% indium and 0-30 wt.% tin. USE - Preparation of liquid metal in-situ composite graphene thermal interface material (claimed) used as effective thermal bonding agent and diffusion barrier for metal-gallium oxide interface in liquid metal matrix. ADVANTAGE - The method solves the problem of low thermal conductivity and bad stability of the composite material, realizing the purpose of improving the thermal conductive and stability of composite material. Because the graphene has high heat conductivity coefficient, so can improve the thermal conductor and stability after compounding with the liquid metal, compared with the traditional mechanical stirring mode, the method of carbon dioxide decomposition can make the material dispersed more uniformly. The method can solve the problem that the powder with fine particles added in molten metal (LM) generates agglomeration problem, each material interface constructs the electron heat transmission network of particle-film-liquid metal, and reducing the traditional phonon-electron interface consumption.