• 专利标题:   Thermally-conductive paste, used in e.g. LED, comprises carrier e.g. epoxy resin, graphene platelet dispersed in carrier, and packing materials dispersed in carrier, where a portion of packing materials contacts surface of graphene platelet.
  • 专利号:   US2013221268-A1, CN103289651-A, TW201335350-A
  • 发明人:   SUNG C, LIN I, LIN H, LIN Y, SONG J
  • 专利权人:   SUNG C, LIN I, LIN H, LAIZUAN CO LTD, RITEDIA CORP
  • 国际专利分类:   C09K005/00, C09K005/08, C08K003/00, C09K005/14
  • 专利详细信息:   US2013221268-A1 29 Aug 2013 C09K-005/00 201360 Pages: 4 English
  • 申请详细信息:   US2013221268-A1 US483942 30 May 2012
  • 优先权号:   TW106474

▎ 摘  要

NOVELTY - Thermally-conductive paste comprises: a carrier; at least one graphene platelet dispersed in the carrier; and many packing materials dispersed in the carrier, where at least a portion of the packing materials contacts a surface of the graphene platelet. USE - The thermally-conductive paste is useful in semiconductors, transistors, integrated circuits, printed circuit board, LED or high power gas discharge lamps. ADVANTAGE - The thermally-conductive paste: can function as both a high thermal conduction fluid material and a high electric conduction fluid material; utilizes the graphene platelet having high strength and flexibility and continuous two dimensional structure, hence exhibits fewer phase boundaries and improved thermal conductivity coefficient as compared to conventional thermally-conductive fluid materials; and utilizes the packing materials, which are prevented from aggregation.