▎ 摘　　要

NOVELTY - Resin composition having enhanced heat releasing properties, comprises: a liquid crystal oligomer, an epoxy resin or their resin mixture; and a filler comprising graphene oxide. USE - The resin composition is useful: for manufacturing a heat releasing film for an electronic device, an insulating film for a printed circuit board; and in a prepreg (claimed). ADVANTAGE - The resin composition: has enhanced heat releasing properties, without decreasing thermal and mechanical properties of an insulating material; has high dispersibility and hence exhibits superior heat resistance and mechanical strength; and provides heat releasing film, insulating film with coefficient of thermal expansion (CTE) of 20 ppm/oC or less and prepreg with low CTE and enhanced heat releasing properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a prepreg manufactured by impregnating a base material with the resin composition.