▎ 摘　　要

NOVELTY - A heat dissipating printed circuit board comprises a substrate component (1) having an insulating layer (3) made of prepreg laminated on the upper surface, an electrically conductive layer (5) printed on top of the insulating layer and forming a circuit connecting electrical and electronic components, a heat dissipation layer (11) laminated on the bottom surface of the substrate component to emit heat, and a secondary insulating layer (6) formed on the upper surface of the electrically conductive layer. The electrical and electronic components are soldered and bonded to the electrical conductive layer through the secondary insulating layer. The substrate component is made of a carbon-based material (m1) containing 20-60 wt.% carbon-based mixture material, 20-60 wt.% polymer resin and 5-20 wt.% silicate. The heat dissipation layer is made of a carbon-based material (m2) having more thermal conductivity than the carbon-based material (c1). USE - Heat dissipating printed circuit board used for electronic device. Uses include but are not limited to aerospace application, aircraft fuselages, automobile, telecommunication, antenna, air purifier, water purifier, LED, etc. ADVANTAGE - The heat dissipation type printed circuit board has excellent thermal conductivity in horizontal direction, and improved overall heat dissipating effect, and greatly improves stability and durability of the product in which the substrate is used. DETAILED DESCRIPTION - A heat dissipating printed circuit board comprises a substrate component (1) having an insulating layer (3) made of prepreg laminated on the upper surface, an electrically conductive layer (5) printed on top of the insulating layer and forming a circuit connecting electrical and electronic components, a heat dissipation layer (11) laminated on the bottom surface of the substrate component to emit heat, and a secondary insulating layer (6) formed on the upper surface of the electrically conductive layer. The electrical and electronic components are soldered and bonded to the electrical conductive layer through the secondary insulating layer. The substrate component is made of a carbon-based material (m1) containing 20-60 wt.% carbon-based mixture material, 20-60 wt.% polymer resin and 5-20 wt.% silicate. The heat dissipation layer is made of a carbon-based material (m2) having more thermal conductivity than the carbon-based material (c1). The carbon-based mixture material contains 2-20 wt.% carbon material dispersion and 80-98 wt.% graphite material obtained by dispersing in a solvent after crushing one or more materials chosen from carbon nanotubes, graphene, and carbon fibers. The carbon material in the carbon material dispersion connects the particles of the graphite material having a particle size of 1-50 μ m by a covalent bond. The graphite material is made by mixing 65-80 wt.% sheet graphite and 20-35 wt.% nodular graphite. The overall thermal conductivity is increased by increasing the thermal conductivity in the vertical direction even when the thermal conductivity in the horizontal direction is reduced compared to the plate graphite. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of LED mounted on a heat dissipating printed circuit board. 1Substrate component 3Insulating layer 5Electrically conductive layer 11Heat dissipation layer