▎ 摘　　要

NOVELTY - Preparation of manganese-nickel-cobalt-based high temperature-resistant flexible heat-sensitive device involves mixing thermo-sensitive oxide powder-doped carbon material and organic carrier, defoaming, grinding to obtain slurry, screen printing slurry on high temperature-resistant flexible substrate to obtain heat-sensitive thick film, curing, covering cured film with high temperature-resistant flexible substrate, encapsulating to obtain encapsulation layer, cold isostatic pressing, peeling off encapsulation layer and high temperature-resistant flexible substrate, taking out heat-sensitive thick film, sintering to obtain processed heat-sensitive thick film, forming electrode on processed film, drying, annealing electrode, welding the outer lead on electrode by bonding method to obtain component layer of flexible heat-sensitive device, screen printing polyester resin, parylene or epoxy resin on component layer of flexible heat-sensitive device to obtain insulating layer and drying. USE - Preparation of manganese-nickel-cobalt-based high temperature-resistant flexible heat-sensitive device such as temperature sensor. ADVANTAGE - The preparation method produces heat-sensitive device with excellent high-temperature resistance, flexibility, simple structure, precise and controllable thickness, and high yield, and is suitable for mass production. The flexible heat-sensitive device can work at high temperature for long time. DETAILED DESCRIPTION - Preparation of manganese-nickel-cobalt-based high temperature-resistant flexible heat-sensitive device involves adding deionized water to weighed metal salt raw material, heating and stirring in water bath until saturated metal salt solution is formed, dissolving alkali in deionized water to form alkali solution, slowly adding saturated metal salt solution to alkali solution while stirring in water bath, stirring and leaving still to obtain precipitate, washing the precipitate, suction filtering and freeze-drying to obtain product powder, sintering, ball milling and freeze-drying to obtain nano heat-sensitive oxide powder, preparing thermo-sensitive oxide powder-doped carbon material by adding carbon material dispersion to the nano heat-sensitive oxide powder, stirring in vacuum stirring and degassing machine, freeze-drying using vacuum freeze dryer at -40degrees Celsius for 48 hours, and grinding for 30 minutes, mixing 50-70 pts. wt. terpineol, 4-8 pts. wt. ethyl cellulose, 10-20 pts. wt. diethylene glycol butyl ether, 8-16 pts. wt. diethylene glycol butyl ether acetate, and 5-10 pts. wt. Span 85 (RTM: sorbitan trioleate) and stirring to obtain organic carrier, mixing thermo-sensitive oxide powder-doped carbon material and organic carrier in mass ratio of 8:2, 7:3, 6:4, or 5:5 using vacuum stirring deaerator at 1000-3000 rpm for 2-8 minutes, defoaming for 1-4 minutes to obtain slurry, grinding for 5-10 times the slurry in three-roll mill at speed of 100-200 rpm for 20-40 minutes to obtain slurry, screen printing the slurry on high temperature-resistant flexible substrate to obtain heat-sensitive thick film with thickness of 5-10 mum, curing heat-sensitive thick film in oven at 150degrees Celsius for 12 hours, covering the cured heat-sensitive thick film with high temperature-resistant flexible substrate of same size and shape, encapsulating using vacuum packaging equipment to obtain encapsulation layer, cold isostatic pressing at pressure of 100-300 MPa for 1-5 minutes, peeling off encapsulation layer and high temperature-resistant flexible substrate, taking out heat-sensitive thick film, placing it on the corundum board, sintering under protection of nitrogen to obtain processed heat-sensitive thick film, forming electrode on processed heat-sensitive thick film by screen printing process, drying in oven at 150degrees Celsius for 2 hours, annealing the electrode in box furnace at 400-1000degrees Celsius for 20-60 minutes, welding the outer lead on the electrode by bonding method to obtain component layer of flexible heat-sensitive device, screen printing polyester resin, parylene or epoxy resin on the component layer of flexible heat-sensitive device to obtain insulating layer and drying in oven at 80degrees Celsius for 4 hours. The manganese-nickel-cobalt-based high temperature-resistant flexible thermal device comprises high temperature-resistant flexible substrate, heat-sensitive thick film, electrode and insulating layer.