• 专利标题:   Conductive paste useful for circuit boards, preferably in flexible circuit boards comprises curing agent and polyester resins, polyurethane resins, epoxy resins, acrylic resins, phenolic resins, alkyd resins, silicone resins, vinyl resins, polyimide resins and thermoplastic elastomer.
  • 专利号:   CN115394473-A
  • 发明人:   YU Y, BAI P, REN Z, WANG X, WANG H
  • 专利权人:   BEIJING DREAM INK TECHNOLOGIES CO LTD
  • 国际专利分类:   H01B001/22, H01B001/24, H05K001/02, H05K001/09
  • 专利详细信息:   CN115394473-A 25 Nov 2022 H01B-001/22 202307 Chinese
  • 申请详细信息:   CN115394473-A CN11196332 29 Sep 2022
  • 优先权号:   CN11196332

▎ 摘  要

NOVELTY - Conductive paste comprises 1-10 wt.% curing agent and 4.5-13 wt.% composite resin. The composite resin includes a first resin and a second resin with a mass ratio of (0.5-3): (4-10). The first resin is polyester resins, polyurethane resins, epoxy resins, acrylic resins, phenolic resins, alkyd resins, silicone resins, vinyl resins and/or polyimide resins. The second resin is a thermoplastic elastomer. USE - The conductive paste is useful for circuit boards, preferably in flexible circuit boards (claimed). ADVANTAGE - The conductive paste: has good resilience and good low temperature resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: preparing conductive paste comprising mixing the components and grinding, (1) uniformly mixing the first resin, the first solvent and part of the second solvent to obtain a first premix, uniformly mixing the second resin and the remaining part of the second solvent to obtain a second premix and (2) mixing the first premix, the second premix, curing agent, conductive filler and auxiliary agent uniformly and grinding; and an electronic device.