▎ 摘　　要

NOVELTY - High-performance lead-free solder comprises 0.6-0.8 wt.%, preferably 0.7 wt.% copper, 1-1.5 wt.%, preferably 1.3 wt. bismuth, 0.02-0.04 wt.%, preferably 0.03 wt.% neodymium, 0.04-0.06 wt.%, preferably 0.05 wt.% phosphorus, 0.002-0.01 wt.%, preferably 0.008 wt.% germanium, 0.01-0.05 wt.%, preferably 0.03 wt.% nickel, 0.03-0.05 wt.%, preferably 0.045 wt.% modified graphene, and balance is tin. USE - Lead-free solder for high performance electronic industry. ADVANTAGE - The solder has good wettability, oxidation resistance, and the formed welding point has good mechanical performance, and welding joint is reliable.