• 专利标题:   Enhanced heat dissipation composite structure, comprises graphene film and metal layer deposited on upper surface of graphene film, where graphene film and metal layer are provided with array via holes.
  • 专利号:   CN110145728-A, CN110145728-B
  • 发明人:   FAN D, WANG J, LI Q
  • 专利权人:   UNIV NANJING SCI TECHNOLOGY
  • 国际专利分类:   B32B015/04, B32B015/20, B32B003/08, B32B003/26, B32B007/12, F21V029/83, F21V029/85, F21V029/89, F21Y115/10
  • 专利详细信息:   CN110145728-A 20 Aug 2019 F21V-029/83 201973 Pages: 9 Chinese
  • 申请详细信息:   CN110145728-A CN10492168 06 Jun 2019
  • 优先权号:   CN10176317

▎ 摘  要

NOVELTY - An enhanced heat dissipation composite structure comprising a graphene film (2) and a metal layer (3) deposited on an upper surface of the graphene film. The graphene film and the metal layer are provided with array via holes, and the metal layer and the inner wall surface of the array via hole are adhered with polyimide (4). USE - Enhanced heat dissipation composite structure. ADVANTAGE - The heat dissipation composite structure improves the thermal conductivity, the overall heat dissipation efficiency and the uneven temperature distribution on the radiation surface and promotes the conduction of heat on the entire radiation surface. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for fabricating a heat-reinforcing composite structure, which involves forming a graphene oxide film by self-assembly at a gas-liquid interface and obtaining a graphene film by carbonization, graphitization and post-pressing, treating the graphene film with oxygen plasma and depositing on the metal layer by DC magnetron sputtering, forming an array via hole on the film of the graphene film and the metal layer by etching method, preparing polyimide acid and coating on the film having the array through holes, subjecting the polyimide acid-coated film to suction filtration to allow the polyimide to permeate into the sidewall of the array through-hole, placing the polyimide acid-coated film in an atmosphere furnace and subjecting the polyimide acid to imidization by stepwise heating to obtain a heat-reducing composite structure. DESCRIPTION OF DRAWING(S) - The drawing shows an enlarged perspective view of an enhanced heat dissipation composite structure. Graphene film (2) Metal layer (3) Polyimide (4)