▎ 摘　　要

NOVELTY - Metallization of PTFE circuit board holes involves preparing liquid phase dispersion graphene solution, soaking PTFE circuit board in graphene solution, volatilizing solvent, performing chemical copper deposition and performing copper electroplating method. USE - Metallization of PTFE circuit board holes. The method can also be used for mirror glass and polyimide materials. ADVANTAGE - The method improves the conductivity of the PTFE material surface and increases the wet ability of water, so that the chemical copper can be deposited on the modified PTFE surface, finally electroplating thickened copper plating, realizing the hole metallization of the PTFE circuit board.