▎ 摘　　要

NOVELTY - Epoxy resin curing process stress monitoring device comprises a substrate, a graphene strain sheet, an LCR bridge, a power supply and a monitoring terminal. One pair of welding pins of the substrate is welded with the graphene strain sheets. The other pair of the welding pins is welding with a wire, and is connected with the power supply through the wire. The LCR Bridge is connected to the graphene strata sheet and the monitoring terminal respectively. USE - Epoxy resin curing process stress monitoring device. ADVANTAGE - The device avoids the problem of potential safety hazard caused by the deterioration of the material performance of the electric device, and improves the safety and stability of the operation of the device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an epoxy resin curing process stress monitoring method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of the epoxy resin curing process stress monitoring device (Drawing includes non-English language text).