▎ 摘　　要

NOVELTY - The method involves fabricating (S110) an upper electrode on the first surface of the first flexible electrode substrate, and fabricating a lower electrode on the first surface of the second flexible electrode substrate. The upper and lower electrodes include aasteriskb first and second ultrasonic array element contact points located in a-row and b-column. The aasteriskb ultrasonic array elements are bonded (S120) to the contact points of the first ultrasonic array element of the upper electrode and the contact points of the second ultrasonic array element of the lower electrode respectively using a conductive adhesive. The gaps between the ultrasonic array elements are filled (S130), heated and cured. A graphene piezoresistive array is fabricated (S140) on the second surface of the first flexible electrode substrate and the second surface of the second flexible electrode substrate respectively. The graphene piezoresistive array includes several graphene piezoresistive elements. USE - Method for manufacturing flexible ultrasonic area array (claimed) such as graphene piezoresistive array applied to medical treatment and industrial non-destructive inspection field. ADVANTAGE - The deformation of the flexible ultrasonic array is measured in real time through the graphene piezoresistive array, which effectively eliminates the distortion in the ultrasonic imaging caused by the deformation of the flexible array. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a ultrasonic imaging method based on flexible ultrasonic area array. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram illustrating the method for manufacturing flexible ultrasonic area array. (Drawing includes non-English language text) Step for fabricating upper electrode on first surface of first flexible electrode substrate and fabricating lower electrode on first surface of second flexible electrode substrate (S110) Step for bonding ultrasonic array elements to contact points of first ultrasonic array element of upper electrode and contact points of second ultrasonic array element of lower electrode (S120) Step for filling gaps between ultrasonic array elements, and heating and curing (S130) Step for fabricating graphene piezoresistive array on second surface of first flexible electrode substrate and second surface of second flexible electrode substrate (S140)