▎ 摘　　要

NOVELTY - Modified graphene-based epoxy resin composite material comprises 30-50 wt.% epoxy resin, 11-27.5 wt.% modified graphene, 5.5-22 wt.% modified silicon carbide, 24-40 wt.% curing agent and 0.3-2 wt.% accelerator. The modified graphene is obtained by modifying graphene through silane coupling agent I, and the modified silicon carbide is obtained by modifying silicon carbide through silane coupling agent II. The silane coupling agent I and the silane coupling agent II are KH-792, KH550 or KH-602. USE - The composite material is useful in electronic device (claimed). ADVANTAGE - The modified graphene-based epoxy resin composite material has improved dielectric constant, heat conducting and conductive performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the composite material.