• 专利标题:   Graphene-free high-temperature pressure sensor chamber, has high-temperature pressure sensor fixed with graphene/boron nitride hetero-junction part that is formed as three-layer structure to perform material preparation process.
  • 专利号:   CN106052909-A, CN106052909-B
  • 发明人:   LI M, OH S
  • 专利权人:   UNIV NORTH CHINA
  • 国际专利分类:   G01L001/18, G01L009/06
  • 专利详细信息:   CN106052909-A 26 Oct 2016 G01L-001/18 201677 Pages: 9 Chinese
  • 申请详细信息:   CN106052909-A CN10557637 14 Jul 2016
  • 优先权号:   CN10557637

▎ 摘  要

NOVELTY - The chamber has a high-temperature pressure sensor connected with a non-cavity substrates structure to reduce noise pressure signal. The high-temperature pressure sensor is fixed with a graphene/boron nitride hetero-junction part (2). A sensing element senses an external pressure. The graphene/boron nitride hetero-junction part is formed as a three-layer structure to perform high temperature resistant material preparation process at 900 degree centigrade. Thickness of a boron nitride layer is about 20nm-30nm. A substrate (1) is fixed at a center part of a heat insulating lug boss (6). USE - Graphene-free high-temperature pressure sensor chamber. ADVANTAGE - The chamber can reduce liquid thermal expansion noise pressure. DESCRIPTION OF DRAWING(S) - The drawing shows a side sectional view of a graphene-free high-temperature pressure sensor chamber. '(Drawing includes non-English language text)' Substrate (1) Graphene/boron nitride hetero-junction part (2) Heat insulating lug boss (6) Screw thread (7) Bottom fixing base (8)