• 专利标题:   Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.
  • 专利号:   CN113321806-A
  • 发明人:   XU G, XUE F, ZHOU J
  • 专利权人:   SHANGHAI RES INST SYNTHETIC RESINS
  • 国际专利分类:   C08G073/10, C08K003/04, C08K003/22, C08K003/34, C08K003/38, C08K005/544, C08K007/06, C08K007/10, C08K007/14, C08L079/08, C09K005/14
  • 专利详细信息:   CN113321806-A 31 Aug 2021 C08G-073/10 202186 Pages: 11 Chinese
  • 申请详细信息:   CN113321806-A CN10131906 29 Feb 2020
  • 优先权号:   CN10131906

▎ 摘  要

NOVELTY - Manufacture of thermally conductive polyimide composite molded plastic involves dispersing polyimide copolymer molding powder and thermally conductive filler are to prepare a thermally conductive polyimide composite powder material, hot-molding thermally conductive polyimide composite powder material for forming thermally conductive polyimide composite molded plastic by hot molding, mixing the thermally conductive filler with a solvent, an aromatic diamine and an aromatic dibasic acid anhydride to prepare a polyamic acid with a thermally conductive filler, performing chemical imidization and thermal imidization, and heat treating to obtain a powdery polyimide composite thermally conductive molding powder, heat-molding the powdery polyimide composite thermally conductive molding powder. USE - Preparation of thermally conductive polyimide composite molded plastic (claimed) used in electronic appliance and aerospace applications. ADVANTAGE - The method enables preparation of thermally conductive polyimide composite molded plastic with excellent thermal conductivity, mechanical properties and temperature resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the thermally conductive polyimide composite molded plastic.