• 专利标题:   Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.
  • 专利号:   WO2022215644-A1, TW202248341-A, JP2022547311-X
  • 发明人:   SUEMATSU M, URAYAMA T, ENAMI T, SATO K
  • 专利权人:   SEKISUI CHEM CO LTD
  • 国际专利分类:   C08K003/04, C08L063/00, C09J011/04, C09J163/00, C09K003/10, G02B005/20
  • 专利详细信息:   WO2022215644-A1 13 Oct 2022 C08L-063/00 202292 Pages: 34 Japanese
  • 申请详细信息:   WO2022215644-A1 WOJP016480 31 Mar 2022
  • 优先权号:   JP065996

▎ 摘  要

NOVELTY - Curable resin composition comprises an epoxy resin, a carbon material having a graphene laminated structure, and a resin, where the content of the composite is 0.1-30 wt.% with respect to the total curable resin composition. USE - The composition is used in an adhesive for optical light receiving and emitting modules, a sealing agent for an optical light emitting/receiving module, and optical light emitting/receiving module member (all claimed). The optical light emitting/receiving module member is used for various peripheral members of substrates in cameras such as time-of-flight camera built in mobile electronic devices such as smartphones and for an optical lens of a microscope. ADVANTAGE - The composition has excellent coating workability and forms a member having excellent light shielding properties in the visible light region to the near-infrared region. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an optical light emitting/receiving module member, which is a cured product of the curable resin composition.