• 专利标题:   Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.
  • 专利号:   WO2022107730-A1, TW202229438-A, JP2022563748-X
  • 发明人:   TAKASHI Y, YONEDA T
  • 专利权人:   NAMICS CORP
  • 国际专利分类:   C08K003/04, C08K003/08, C08K005/54, C08L063/00, H05K009/00, C08G059/18, C08K005/5419, C09D163/00, C09D007/61, C09D007/63
  • 专利详细信息:   WO2022107730-A1 27 May 2022 202256 Pages: 48 Japanese
  • 申请详细信息:   WO2022107730-A1 WOJP041959 15 Nov 2021
  • 优先权号:   JP191554

▎ 摘  要

NOVELTY - Composition comprises (A) a silver particles, (B) a resin and (C) an alkoxysilane compound, where the content of alkoxysilane compound (C) is 8-100 parts mass based on 100 parts mass silver particles (A). USE - The composition is useful in electronic component for shielding electromagnetic waves (claimed), which is used for forming electromagnetic wave shielding layer on electronic component mounted on substrate, used for electronic devices, such as mobile phones, smartphones, notebook computers, and tablet terminals, used for electronic components, such as power amplifiers, Wi-Fi/bluetooth modules, and flash memories. ADVANTAGE - The composition uniformly forms coating film on entire object even at a corner portion of electronic component.