▎ 摘　　要

NOVELTY - Resin composition, comprises (a) 100 pts. wt. epoxy resin, 2-100 pts. wt. epoxy curing agent, 0.05-1 pts. wt. curing accelerator, 1-10% carboxylated nitrile rubber, and 5-200 wt.% oxazoline compound. The preparation method of resin composition is mixing the dissolved components epoxy resin, epoxy resin curing agent, carboxylated nitrile rubber, oxazoline compound to prepare a resin mixture; pre-reacting the above resin mixture at 50-100°C for 2-30 hours to obtain a pre-reactant; adding the curing accelerator to the above-mentioned pre-reactant, stirring and mixing evenly to prepare the resin composition. USE - The low-flow glue prepreg is used for bonding layer material in rigid-flexible combined printed circuit board production, mobile phone, wireless earphone, AR glasses and other consumer electronics field, automobile, military industry, industrial control and medical application fields. ADVANTAGE - While ensuring the low-flow adhesive prepreg has excellent toughness and low powder removal rate, it significantly improves the adhesion and the appearance of the low-flow adhesive prepreg. It is a low-flow adhesive prepreg with excellent comprehensive properties e.g. high efficiency, interlayer adhesion of the adhesive sheet, apparent flatness of the adhesive sheet, and heat resistance. It can be well used for rigid-flexible printed circuit boards. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: low-flow adhesive prepreg made of resin composition, where the resin composition is dissolved in a solvent to make a glue solution, and then the reinforcing material is impregnated in the above-mentioned glue solution, after heating and drying the impregnated reinforcing material, the low-flow glue prepreg can be obtained; and rigid-flexible printed circuit board, containing the low-flow adhesive prepreg.