▎ 摘　　要

NOVELTY - The device has a semiconductor refrigerating sheet (2) connected with a power supply unit and a cold side heat radiating unit. The cold side heat radiating unit is connected with a hot side heat radiating unit and formed with a cooling space (1). An N-type semiconductor is connected with the cold side heat radiating unit and the hot side heat radiating unit. A P-type semiconductor is connected with the N-type semiconductor that is fixed with a graphene layer. The graphene layer is fixed with the P-type semiconductor. A heat conductor (41) is connected with a heat radiating sheet (42). USE - Cooling device. ADVANTAGE - The device can prevent the semiconductor refrigerating sheet from being damaged. DETAILED DESCRIPTION - The conductor is a graphite alkene heat guide body. DESCRIPTION OF DRAWING(S) - The drawing shows a partial sectional view of a cooling device. Cooling space (1) Semiconductor refrigerating sheet (2) Heat insulation layer (11) Guide heat conductor (41) Heat radiating sheet (42)