1. 平台首页
  2. 国际专利信息
  • 专利标题:   Graphene reinforced lead-free solder contains graphene and lead-free solder alloy containing tin-silver-copper alloy in preset weight ratio.
  • 专利号:   CN102581504-A, CN102581504-B
  • 发明人:   HAN Y, JING H, LIU X, XU L
  • 专利权人:   UNIV TIANJIN
  • 国际专利分类:   B23K035/24, B23K035/40
  • 专利详细信息:   CN102581504-A 18 Jul 2012 B23K-035/24 201263 Pages: 7 Chinese
  • 申请详细信息:   CN102581504-A CN10080713 23 Mar 2012
  • 优先权号:   CN10080713

▎ 摘　　要

NOVELTY - A graphene reinforced lead-free solder contains graphene and lead-free solder alloy in weight ratio of 0.75-1.75:50000. The lead-free solder alloy is tin-silver-copper alloy, and carries out soft soldering of substrate. USE - Graphene reinforced lead-free solder. ADVANTAGE - The graphene reinforced lead-free solder has excellent mechanical characteristics and reliability, and is environmentally-friendly. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of graphene reinforced lead-free solder.