▎ 摘　　要

NOVELTY - The packaging structure includes a package layer and LED (20). The encapsulation layer (10) comprises a graphene layer (1) and a growth layer (2). The growth layer is positioned above the LED. The graphene layer is located above the growth layer. The growth layer is made of copper. The thickness of the graphene layer is 2-10 nano-meter. The encapsulation layer also comprises a barrier layer. The barrier layer is located between the growth layer and the LED. The barrier layer prevents diffusion of the growth layer. USE - Packaging structure for organic LED (OLED). ADVANTAGE - The manufacturing equipment and the manufacturing process are simple and reduce the production cost. Thus, the production efficiency is improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing a package structure. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of the package structure. Graphene layer (1) Growth layer (2) Driving board (6) Encapsulation layer (10) LED (20)