▎ 摘　　要

NOVELTY - Preparation of electronic packaging material, involves using 2 %mass graphene oxide, 50 %mass silicon carbine particles and aluminum alloy powder which comprises 50 %mass aluminum-40 %mass silicon alloy powder and 50 %mass aluminum-0.2 %mass beryllium alloy powder, preparing mixed powder, preparing sheath and carrying out physical sintering. USE - Preparation of electronic packaging material for military electronic device, portable aerospace device, and military power hybrid circuits used in weight sensitive fields, microwave tube carrier, heat sink for multi-chip module and fabrication of ultra-high-power module. ADVANTAGE - The electronic packaging material has density of lower than 3.1 g/cm3, and thermal conductivity of greater than 180 W/(mK), and is lightweight, so that the comprehensive performance of military electronic device is greatly improved.