▎ 摘　　要

NOVELTY - The structure has a flexible substrate film (102) provided with electrical conductors. A lighting module is provided on the flexible substrate film, and provided with a circuit board (112) for hosting electronics. A circuitry (114) is arranged on the circuit board and provided with a light source and a secondary electronic component. A three-dimensional (3D)-shaped sheet (602) is provided with thermally conductive sheet material thermally connecting to the circuit board. The 3D-shaped sheet is extended by a 3D-shape through the substrate film via a hole in the substrate film. A thermoplastic layer (108) is provided with multiple thermoplastic materials molded on the flexible substrate film and laterally surrounds the lighting module. The circuitry on the circuit board of the lighting module is electrically and thermally connected to a number of locations of the remaining multilayer structure by a side of or below the circuit board utilizing connection material. USE - Integrated functional multi-layer structure for being attached to electronics and electronic products. Uses include but are not limited to product packages or casings, visual design of device housings, personal communications device, personal electronic devices, displays, detectors or sensors, vehicle interior or exterior such as dashboard or panel, antenna, labels and computer. ADVANTAGE - The structure provides size savings, weight savings, cost savings, or efficient integration of components when a resulting solution ultimately exhibits a multilayer nature. DETAILED DESCRIPTION - The connection material is selected from a group consisting of electrically and thermally conductive material, thermally conductive electrically insulating material and electrically conductive thermally insulating material. The 3D-shaped sheet comprises electrically insulating material and graphene. The thermoplastic layer comprises translucent material. The light source is selected as a packaged semiconductor-type or a chip-on-board semiconductor-type light source. The circuit board is selected from a group consisting of a flexible film or sheet, a rigid sheet, a rectangular sheet or film, a rounded or essentially circular sheet or film, aflame retardant-4 based circuit board, a metal core circuit board, a plastic substrate, a molded plastic substrate, a metal substrate, and a ceramic circuit board. The flexible substrate film is selected from a group consisting of polymer, thermoplastic material, electrically insulating material, polymethyl methacrylate, poly carbonate, copolyester, copolyester resin, polyimide, a copolymer of methyl methacrylate and styrene, glass, polyethylene terephthalate, carbon fiber, organic material, bio-material, leather, wood, textile, fabric, metal, organic natural material, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural textile or fabric material, naturally grown material, cotton, wool, linen and silk. An INDEPENDENT CLAIM is included for a method for manufacturing an integrated functional multi-layer structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat transfer element comprising a 3D-shaped sheet in connection with the integrated functional multi-layer structure. 102 flexible substrate film 108thermoplastic layer 112circuit board 114Circuitry 6023Dshaped sheet