• 专利标题:   Preparing graphene fiber thermally conductive gasket used in electronic device, comprises modifying graphene fibers with coupling agent, and then mixing with matrix resin and curing agent to prepare.
  • 专利号:   CN114456418-A
  • 发明人:   XIAO W, DU Y, ZHAO L, WANG Z, CAI J
  • 专利权人:   GUANGDONG MORION NANOTECH CO LTD
  • 国际专利分类:   C08J005/18, C08K007/06, C08K009/06, C08L083/04, C09K005/14
  • 专利详细信息:   CN114456418-A 10 May 2022 C08J-005/18 202283 Chinese
  • 申请详细信息:   CN114456418-A CN10089682 25 Jan 2022
  • 优先权号:   CN10089682

▎ 摘  要

NOVELTY - Preparing graphene fiber thermally conductive gasket comprises obtaining a first graphene fiber and a second graphene fiber. The first graphene fiber and the second graphene fiber are modified with a coupling agent, and then dried to prepare the first modified graphene fiber and the second modified graphene fiber. The first modified graphene fibers are chopped to prepare chopped graphene fibers. The chopped graphene fibers are mixed with a matrix resin and a curing agent to prepare a mixture. The second modified graphene fibers are arranged into bundles and placed in a mold, and then the mixed material is injected into the mold, and then a curing treatment is performed to prepare a thermally conductive resin. The thermally conductive resin is sliced along the radial direction of the second modified graphene fiber to prepare the graphene fiber thermally conductive gasket. USE - Method for preparing a graphene fiber thermally conductive gasket used in an electronic device (claimed). ADVANTAGE - The method prepares the graphene fiber thermally conductive gasket with high thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device, which comprises a body and a heat dissipation component for heat dissipation of the body, where the heat dissipation component comprises the graphene fiber thermal conductive gasket.