▎ 摘　　要

NOVELTY - The chip has a heat radiation unit connected between with a cold end and a heat end of an N-type semiconductor and a P-type semiconductor. The N-type semiconductor metal is connected with a P-type semiconductor metal. A metal conductor is connected to positive and negative electrodes of a power supply. The N-type semiconductor and the P-type semiconductor are provided with a graphene. A silicon base is formed with a hanging hole (7). A supporting layer (8) is formed with a graphene protection layer (9) and a micropore. USE - Semiconductor refrigeration graphene chip. ADVANTAGE - The chip is simple in structure, and has wide application range and high refrigeration broad band infrared detection performance effect, and improves cooling capability and sensitivity, and consumes less production cost. DESCRIPTION OF DRAWING(S) - The drawing shows a front view of a semiconductor refrigeration graphene chip. Hanging hole (7) Supporting layer (8) Graphene protection layer (9)