▎ 摘　　要

NOVELTY - Encapsulate comprises a liquid metal core, and liquid metal core comprising at least one of mercury (Hg), indium (In), gallium (Ga) and mixtures, or an alloy comprising Hg, tin (Sn), In, Ga and mixtures, and at least one of lead (Pb), antimony (Sb), cadmium (Cd), bismuth (Bi), aluminum (Al), zinc (Zn), silver (Ag), gold (Au), or titanium (Ti), and one or more shells that encapsulate liquid metal. The one or more shells comprising a first shell comprising a two dimensional material, two dimensional material being selected from the group consisting of graphene oxide, graphene, modified graphene, modified graphene oxide, boron nitride, modified boron nitride, transition metal dichalcogenides, transition metal tri-chalcogenides, clays, MXenes, and mixtures, or charge neutral ceramic comprising an anion and a cation. USE - Encapsulate. ADVANTAGE - The encapsulate can be designed to respond to one or more stimuli of choice, including but not limited to electromagnetic, thermal, mechanical, photonic, and/or magnetic and are environmentally robust. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of using an encapsulate, which involves connecting two or more electrical connections with a connector comprising encapsulates, connector being a solid, a liquid or a liquid comprising a solid, and connecting two or more thermal connections with a connector comprising encapsulates, connector being a solid, a liquid or a liquid comprising a solid.