▎ 摘　　要

NOVELTY - Manufacturing a metal structure involves forming a metal layer comprising a metal and a nano-abrasive, the nano-abrasive having an average particle diameter of less than 5 nanometers, and supplying slurry on the metal layer to perform chemical mechanical polishing. USE - Method for manufacturing a metal structure used for metal wire which further used for semiconductor device and for electronic device (all claimed). ADVANTAGE - The prepared metal structure is capable of improving a polishing rate while reducing damage and shape deformation of the metal structure. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing a semiconductor device which involves forming a metal wire.