• 专利标题:   Insulating heat-conducting composite material used in electronic device, comprises thermally conductive concentrated master batch comprising thermoplastic elastomer, inorganic and carbon-based heat conducting filler , and polyamide 66 resin and auxiliary agent.
  • 专利号:   CN114381114-A
  • 发明人:   LI J, LI X, LIU T, YI W, ZHAO L, WANG H, ZHANG M
  • 专利权人:   ENN GRAPHENE TECHNOLOGY CO LTD
  • 国际专利分类:   C08J003/22, C08K013/06, C08K003/04, C08K003/22, C08K003/26, C08K003/28, C08K003/34, C08K003/38, C08K007/06, C08K009/10, C08L023/08, C08L051/06, C08L053/02, C08L077/06
  • 专利详细信息:   CN114381114-A 22 Apr 2022 C08L-077/06 202259 Chinese
  • 申请详细信息:   CN114381114-A CN11116451 19 Oct 2020
  • 优先权号:   CN11116451

▎ 摘  要

NOVELTY - Insulating heat-conducting composite material comprises a thermally conductive concentrated master batch, a polyamide 66 resin and an auxiliary agent. The thermally conductive concentrated masterbatch includes thermoplastic elastomer, inorganic thermally conductive filler and carbon-based thermally conductive filler. The inorganic thermally conductive filler and the carbon-based thermally conductive filler are obtained by surface modification of a coupling agent. The auxiliary agent includes a dispersant and/or an antioxidant. The mass ratio of the thermally conductive concentrated masterbatch and the polyamide66 resin is 1:9 to 5:1. USE - The composite material is useful in the fields of automobiles, machinery and electrical appliances (claimed), and for packaging material for electronic device e.g. CPU, CPU fan, electronic separating plate, and shell of mobile communication device. ADVANTAGE - The composite material has higher mechanical strength and heat conducting coefficient, better processing performance, good plastic insulation, corrosion resistance and chemical medicine resistance, and light weight, low cost, easy processing, low forming energy consumption, which can better satisfy each application requirement of downstream,. The polyhexamethylene polyhexamethylene adipamide (PA66): is non-toxic; and has good electrical insulation, wear resistance, good mechanical performance, heat resistance, alkali resistance, oil resistance, weak acid resistance, weather resistance, high fluidity of molten resin, relative density of 1.05-1.15. The polyamide 66 resin has wide application prospect in the design and production of electronic appliance product. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing the composite material comprising (1) using the coupling agent to coat and modifying the inorganic thermally conductive filler and the carbon-based thermally conductive filler, (2) mixing and granulating the thermoplastic elastomer with modified inorganic thermally conductive fillers and carbon-based thermally conductive fillers to obtain thermally conductive concentrated master batches, and (3) granulating the thermally conductive concentrated masterbatch and the polyamide 66 resin to obtain an insulating and thermally conductive composite material.