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  • 专利标题:   Through-hole copper paste with strong stability and high conductivity useful for preparing stable strong conductive nano-conductive composite film, comprises copper powder, silicon powder, resin curing agent, organic binder, phenol, organic solvent, coagulant aid, reducing agent and conductive agent.
  • 专利号:   CN115602357-A
  • 发明人:   XU J, ZHAN S, PAN Q, QING Y
  • 专利权人:   ZHEJIANG ZHENYOU ELECTRONICS CO LTD
  • 国际专利分类:   H01B001/22, H01B013/00, H05K001/11
  • 专利详细信息:   CN115602357-A 13 Jan 2023 H01B-001/22 202313 Chinese
  • 申请详细信息:   CN115602357-A CN11300499 24 Oct 2022
  • 优先权号:   CN11300499

▎ 摘　　要

NOVELTY - Through-hole copper paste with strong stability and high conductivity comprises copper powder, silicon powder, resin curing agent, organic binder, phenol, organic solvent, polymerization aid, reducing agent and conductive agent. USE - The through-hole copper slurry is useful for preparing stable strong conductive nano-conductive composite film on a printed circuit board (claimed). ADVANTAGE - The through-hole copper slurry has strong stability and high conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of the through hole copper slurry with strong stability and high conductivity.