▎ 摘　　要

NOVELTY - Non-destructive thinning of material with low energy light excitation involves carrying out in-situ growing or transferring a two-dimensional material from a support to another target substrate, pretreating the surface of the material to increase the surface density, controlling the etching condition, and applying an etching excitation on the material to be thinned. USE - Non-destructive thinning of material with low energy light excitation. ADVANTAGE - The method produces thinned material having lattice integrity, excellent physical characteristics, thinning precision reaching atomic level, with in-situ directional etching capability, is compatible with microelectronic technique, uses low power etching excitation and has improved process controllability.