▎ 摘　　要

NOVELTY - Low specific gravity, high thermal conductivity, flame retardant adhesive comprises 20-40 pts. wt. alkoxy-terminated polysiloxane, 5-9 pts. wt. methyltrimethoxysiloxane, 90-110 pts. wt. thermally conductive filler, 8-13 pts. wt. flame retardant, 0.03-0.09 pts. wt. coupling agent, 0.05-0.15 pts. wt. additives. The thermally conductive filler is modified graphene. The flame retardant is modified ethylene-vinyl acetate. USE - Low specific gravity, high thermal conductivity, flame retardant adhesive used to the electronic element, bonding of semiconductor material, electronic appliance and other devices, sealing electric heater, waterproof of electronic instrument, sealing and encapsulating of electronic element, sealing of electric heating end, bonding of small motor magnetic tile and the metal shell, automobile lamp, bonding sealing of optical instrument and lens, bonding the electronic instrument shell, insulating protection of the motor, and bonding and sealing of electronic unit. ADVANTAGE - The low specific gravity, high thermal conductivity, flame retardant adhesive utilizes the modified graphene and modified ethylene-vinyl acetate to replace the traditional graphene and ethylene vinyl acetate, to effectively improve the heat conducting performance and flame retardant performance of the adhesive. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a low specific gravity, high thermal conductivity, flame retardant adhesive, which involves: a. adding alkoxy-terminated polysiloxane, methyltrimethoxysiloxane, thermally conductive filler, and flame retardant into the high-speed dispersant in sequence, raising the temperature to 180℃ under stirring conditions, and then vacuum dehydrating and blending to obtain base material; and b. cooling the base material to 50-60℃, adding coupling agent and auxiliary agent, mixing evenly under the condition of vacuum degree of -0.09-0.1 megaPascal, and then cooling to room temperature to discharge to obtain a product.