• 专利标题:   Electronic structure for use in system for measuring temperature, heart rate, blood pressure or oxygen level, has interconnect film comprising first face, second face opposite first face, electrically conductive zone, and electrically insulating polymeric material.
  • 专利号:   FR3126259-A1, WO2023025667-A1
  • 发明人:   SOURIAU J, DE GIROLAMO J, FOURNIER A
  • 专利权人:   COMMISSARIAT ENERGIE ATOMIQUE, COMMISSARIAT ENERGIE ATOMIQUE
  • 国际专利分类:   H01L023/52, H01L023/532, H01L023/00, H01L023/498, H01L023/538
  • 专利详细信息:   FR3126259-A1 24 Feb 2023 H01L-023/52 202320 Pages: 25 French
  • 申请详细信息:   FR3126259-A1 FR008819 23 Aug 2021
  • 优先权号:   FR008819

▎ 摘  要

NOVELTY - The electronic structure (1) has a substrate (10), an electronic component (20), and an interconnect film (30) arranged between the substrate. The electronic component electrically and mechanically connects the electronic component to the substrate. The interconnect film comprises a first face (30a), a second face (30b) opposite the first face, an electrically conductive zone (31) extending from the first face to the second face, and an electrically insulating polymeric material (32) coating the electrically conductive zone. One of the first and second faces of the interconnect film are structured to form a dry adhesive film. One of the first and second faces have multiple patterns (33). A portion of the patterns is formed of the electrically insulating polymer material. USE - Electronic structure for use in system for measuring temperature, heart rate, blood pressure or oxygen level, actimetry system for measurement and analysis of movements, system for measuring skin secretion e.g. sweat, electrical or optical stimulation system, or drug administration system such as patch transdermal. ADVANTAGE - The electronic structure has an improved lifetime, and has better resistance to tensile and/or shearing stresses. The substrate is advantageously flexible, without breaking, a bending of a radius of curvature less than or equal to 1000 mm. A flexible substrate confers flexibility on the electronic structure, which allows the substrate to be positioned on a non-flat support or on a surface which deforms over time, such as a moving body. The interconnection film is advantageous for absorbing mechanical stresses due to the difference in thermal expansion coefficients between the substrate and the electronic component. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing an electronic structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic sectional view of an electronic structure. 1Electronic structure 10Substrate 20Electronic component 30Interconnect film 30aFirst face 30bSecond face 31Conductive zone 32Polymeric material 33Pattern